| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K4S511632D-UC75 | 内存芯片 |
SAMSUNG/三星 |
TSOP |
0816+ |
2260 |
|||
| IS61WV25616BLL-10TLI | ISSI/芯成 |
TSOP |
22+ |
2893 |
||||
| LP3985IM5-3.3/NOPB | TI/德州仪器 |
SOT23-5 |
22+ |
18922 |
||||
| TNY278PN | 电源IC |
POWER INTEGRATIONS/帕沃英蒂格盛 |
DIP |
14+ |
1608 |
|||
| MAX98307ETE+T | 运放IC |
MAXIM/美信 |
TQFN16 |
1726+ |
1769 |
|||
| NAND512W3A2SZA6E | 内存芯片 |
MICRON/美光 |
BGA |
1603+ |
540 |
|||
| NJM8202V-TE2 | JRC/新日本无线 |
SSOP8 |
1108+ |
1015 |
||||
| NSI8261W0-DSWR | NOVOSENSE/纳芯微 |
sop |
22+ |
99 |
||||
| PC48F4400P0TB0E | MICRON/美光 |
BGA |
13+ |
216 |
||||
| PEB2260NV3.0 | 其他IC |
INFINEON/英飞凌 |
PLCC |
0112+ |
900 |
|||
| PIC18LF47K40-I/PT | MICROCHIP/微芯 |
QFP |
1847+ |
116 |
||||
| TC554001AF-70L | 内存芯片 |
TOSHIBA/东芝 |
SOP |
0428+ |
187 |
|||
| W25Q256JVEIN | WINBOND/华邦 |
WSON8 |
22+ |
450 |
||||
| WD37C65CJM | WDC/西部数据 |
PLCC44 |
9309+ |
866 |
||||
| WGI219LM SLKJ3 | INTEL/英特尔 |
QFN48 |
190820+ |
2430 |
||||
| IP2721 | INJOINIC/英集芯 |
TSSOP16 |
2150+ |
18631 |
||||
| TPL810F33-3TR | 3PEAK/思瑞浦 |
SOT23-3 |
2140+ |
19918 |
||||
| TMS320F28075PTPS | 32位MCU |
TI/德州仪器 |
HLQFP176 |
23+ |
109 |
|||
| M74HC161RM13TR | 其他被动元件 |
ST/意法 |
SOP-16 |
1115+ |
5000 |
|||
| MT41J256M16HA-125:E | 存储IC |
MICRON/美光 |
FBGA |
15+ |
197 |
商家默认展示20条库存